OSP

OSP (Organic Solderability Preservative) is a process that protects the copper surface from oxidation. OSP is applied through chemical adsorption on the copper surface – no metal to metal displacement. In addition to providing a lead-free flat surface, this process is advertised as being a low cost and a simple process that is very eco-friendly. Known disadvantages of using OSP include: not being the ideal choice for plated through-holes or plated-vias, having a short shelf life, and may cause issues with ICT (in-circuit testing).